APEX-NPW-08-12-4
Sn-Ag-Cu series
Lead free resin flux cored wire solder
This product is suitable for soldering of densely packed components required to be highly reliable soldering as flux cored wire solder.
Table .Characteristics
| Items | Characteristics | Test method | |
|---|---|---|---|
| Alloy composition(%) | Sn:Balance, Ag: 3.0, Cu: 0.5 | Allowable impurity level is based on JIS Z 3282 class-A | |
| Solidus temperature(°C) | 217 | DSC (Differential Scanning Calorimetry) | |
| Liquidus temperature(°C) | 220 | ||
| Flux contents(mass %) | 4.0 | JIS Z 3197 8.1.2 | |
| Halide contents(mass%) | 0.10 | JIS Z 3197 8.1.4.2.1 | |
| Copper mirror test | - | JIS Z 3197 8.4.2 | |
| Copper plate corrosion test | Passed | JIS Z 3197 8.4.1 | |
| Insulation resistance test (Ω) | More than 1.0×10⁸ | JIS Z 3197 8.5.3 JIS type, 85°C-85%RH, 168h, measured with DC100V inside of chamber | |
| Migration test | Passed | JIS Z 3197 8.5.3 JIS type, 85°C-85%RH, 1000h, applied with DC48V, visual check | |
| Silver chromate paper test | - | JIS Z 3197 8.1.4.2.3 | |
| Aqueous solution resistance test(Ωm) | 1050 | JIS Z 3197 8.1.1 | |
| Dryness test | Passed | JIS Z 3197 8.5.1 | |
| Spreading factor test(%) | 79 | JIS Z 3197 8.3.1.1 | |
| Flux scattering factor(%) | 1.0 | JIS Z 3197 8.3.2.1 | |
| Remarks | JIS Z 3197:1999 Testing method for soldering fluxes | ||
