APEX-NP-P08-12-04
Sn-Ag-Cu
Pb-free solder paste — RMA type for dispensable
This solder paste is composed of lead free solder alloy and it has good performances. It is superior to wetting, and also it has scarce slump and solder ball after soldering. It has high reliability of RMA-type solder paste.
Table .Characteristics
| Items | Characteristics | Test method | |
|---|---|---|---|
| Alloy composition(%) | Sn: Balance, Ag: 3.0±0.1 Cu: 0.50±0.05 | Allowable impurity level is based on JIS Z 3282 class-A | |
| Solidus temperature(°C) | 217 | DSC (Differential Scanning Calorimetry) | |
| Liquidus temperature(°C) | 220 | ||
| Powder particle size(μm) | 38~25 | JIS Z 8801 | |
| Flux content(mass %) | 14.0±0.5 | JIS Z 3197 8.1.2 | |
| Halide contents(mass %) | 0.09±0.01 | JIS Z 3197 8.1.4.2.1 | |
| Copper plate corrosion test | Passed | JIS Z 3197 8.4.1 | |
| Copper mirror test | Passed | JIS Z 3197 8.4.2 | |
| Insulation resistance test (Ω) | More than 1×10⁸ | JIS Z 3197 8.5.3 85°C-85%RH, 168h, in chamber | |
| Voltage-applied moisture resistance test | Insulation resistance test (Ω) | More than 1×10⁸ | JIS Z 3197 8.5.4 85°C-85%RH, 1000h, 100VDC in chamber |
| Migration | Passed | ||
| Aqueous solution resistance test (Ωm) | More than 1000 | JIS Z 3197 8.1.1 | |
| Dryness test | Passed | JIS Z 3197 8.5.1 | |
| Spreading factor test (%) | More than 75 | JIS Z 3197 8.3.1.1 | |
| Viscosity test(Pa s) | 110±30 | Malcom PCU-2 10rpm, 3minutes | |
| Thixotropic index test | 0.60±0.10 | Calculation | |
