APEX-NPW-20-09-4
Sn-Cu series
Lead free resin flux cored wire solder — Halogen-free type corresponding to J-STD-709
Table .Characteristics
| Items | Characteristics | Test method | |
|---|---|---|---|
| Alloy composition(%) | Sn:Balance, Ag: 0.3, Cu: 3.0 | Allowable impurity level is based on JIS Z 3282 | |
| Solidus temperature(°C) | 217 | DSC (Differential Scanning Calorimetry) | |
| Liquidus temperature(°C) | 312 | ||
| Flux content(mass %) | 4.0 | JIS Z 3197 8.1.2 | |
| Halogen content (ppm) | Cl | Under 50 | JEITA ET-7304 |
| Br | Under 100 | ||
| Copper mirror test | Passed | JIS Z 3197 8.4.2 | |
| Copper plate corrosion test | Passed | JIS Z 3197 8.4.1 | |
| Insulation resistance test(Ω) | More than 1.0×10⁹ | JIS Z 3197 8.5.3 JIS type, 85-85%RH, 168h, measured with DC100V inside of chamber | |
| Migration test | Passed | JIS Z 3197 8.5.3 JIS type, 85-85%RH, 1000h, applied with DC48V, visual check | |
| Aqueous solution resistance test(Ωm) | More than 1000 | JIS Z 3197 8.1.1 | |
| Dryness test | Passed | JIS Z 3197 8.5.1 | |
| Spreading factor test(%) | More than 70 | JIS Z 3197 8.3.1.1 | |
| Remarks | JIS Z 3282:2006 Solders-Chemical compositions and forms JIS Z 3197:1999 Testing method for soldering fluxes JEITA-ET7304(2009): Definition of Halogen-free Soldering Materials Regulation of substance for J-STD-709 Cl, Br<1000 | ||
