APEX-NPW-08-08-3
Sn-Ag-Cu series
Lead free resin flux cored wire solder
This product is suitable for soldering of densely packed components required to be highly reliable soldering as halogen-free flux cored wire solder.
Table .Characteristics
| Items | Characteristics | Test method | |
|---|---|---|---|
| Alloy composition(%) | Sn:Balance, Ag: 3.0±0.1, Cu: 0.5±0.05 | Allowable impurity level is based on JIS Z 3282 | |
| Solidus temperature(°C) | 217 | DSC (Differential Scanning Calorimetry) | |
| Liquidus temperature(°C) | 220 | ||
| Flux content(mass %) | 2.7~3.3 | JIS Z 3197 8.1.2 | |
| Halogen content (ppm) | Cl | Under 50 | JPCA-ES01 |
| Br | Under 100 | ||
| Copper mirror test | No corrosion | JIS Z 3197 8.4.2 | |
| Copper plate corrosion test | No corrosion | JIS Z 3197 8.4.1 | |
| Insulation resistance test(Ω) | More than 1.0×10⁹ | JIS Z 3197 8.5.3 JIS type, 85°C-85%RH, 168h, measured with DC100V inside of chamber | |
| Migration test | No migration | JIS Z 3197 8.5.3 JIS type, 85°C-85%RH, 1000h, applied with DC48V, visual check | |
| Aqueous solution resistance test(Ω m) | More than 1000 | JIS Z 3197 8.1.1 | |
| Dryness test | Passed | JIS Z 3197 8.5.1 | |
| Spreading factor test(%) | More than 70 | JIS Z 3197 8.3.1.1 | |
| Remarks | JIS Z 3282:2006 Solders-Chemical compositions and forms JIS Z 3197:1999 Testing method for soldering fluxes JPCA-ES01:2003 Test Method for Halogen-free Materials | ||
