APEX-NPW-08-02-4
Sn-Ag-Cu series
Lead free flux cored solder wire
MIL-RMA, JIS-A, IPC-ROL1 type lead free type flux cored wire solder.
Good wettability and low flux spattering at soldering.
Supports both laser and iron soldering. Light color flux residue.
Table .Characteristics
| Items | Characteristics | Test method | |
|---|---|---|---|
| Alloy composition(%) | Sn:Balance, Ag: 3.0±0.1, Cu: 0.5±0.05 | Allowable impurity level is based on JIS Z 3282. | |
| Solidus temperature(°C) | 217 | DSC (Differential Scanning Calorimetry) | |
| Liquidus temperature(°C) | 220 | ||
| Flux content(%) | 3.7~4.3 | JIS Z 3197 8.1.2 | |
| Halide content*(%) | 0.08~0.14 | JIS Z 3197 8.1.4.2.1 | |
| Copper mirror test | No corrosion | JIS Z 3197 8.4.2 | |
| Copper plate corrosion test | No corrosion | JIS Z 3197 8.4.1 | |
| Insulation resistance test (Ω) | More than 5.0×10⁸ | JIS Z 3197 8.5.3 JIS type, 85°C-85%RH, 168h, measured with DC100V inside of chamber | |
| Migration test | No migration | JIS Z 3197 8.5.3 JIS type, 85°C-85%RH, 1000h, applied with DC48V, visual check | |
| Aqueous solution resistance test (Ωm) | More than 1000 | JIS Z 3197 8.1.1 | |
| Dryness test | Passed | JIS Z 3197 8.5.1 | |
| Spreading factor test (%) | More than 75 | JIS Z 3197 8.3.1.1 | |
| Remarks | JIS Z 3282:2006 Solders-Chemical compositions and forms JIS Z 3197:1999 Testing method for soldering fluxes | ||
