APEX-NPW-08-03-3
Sn-Ag-Cu series
Pb free resin flux cored wire solder
This product is Fluorine activator type flux cored lead-free solder wire
Good solderability to base materials to solder difficulty, such as stainless, Ni and brass and so on.
Table .Characteristics
| Items | Characteristics | Test method | |
|---|---|---|---|
| Alloy composition(%) | Sn:Balance, Ag: 3.0±0.1, Cu: 0.5±0.05 | Allowable impurity level is based on JIS Z 3282 class-A | |
| Solidus temperature(°C) | 217 | DSC (Differential Scanning Calorimetry) | |
| Liquidus temperature(°C) | 220 | ||
| Flux contents(mass %) | 2.7~3.3 | JIS Z 3197 8.1.2 | |
| Halide contents(mass%) | 0.1~0.4 | JIS Z 3197 8.1.4.2.1 | |
| Fluoride contents(mass%) | 0.2~0.4 | JIS Z 3197 8.1.4.2.4 | |
| Copper plate corrosion test | Passed | JIS Z 3197 8.4.1 | |
| Insulation resistance test(Ω) | More than 1.0×10⁸ | JIS Z 3197 8.5.3 JIS type, 85°C-85%RH, 168h, measured with DC100V inside of chamber | |
| Migration test | Passed | JIS Z 3197 8.5.3 JIS type, 85°C-85%RH, 1000h, applied with DC48V, visual check | |
| Aqueous solution resistance test(Ωm) | More than 700 | JIS Z 3197 8.1.1 | |
| Dryness test | Passed | JIS Z 3197 8.5.1 | |
| Spreading factor test(%) | More than 70 | JIS Z 3197 8.3.1.1 | |
| Remarks | JIS Z 3197:1999 Testing method for soldering fluxes | ||
